Know About the SiP Package Substrates in Details
A SiP package substrate serves as the foundation upon which various semiconductor components, such as chips, passives, and interconnects, are mounted and interconnected. It provides the necessary electrical connections between these components while offering structural support and thermal dissipation capabilities. SiP package substrate come in various forms, including organic substrates, ceramic substrates, and laminate substrates, each with its unique properties and applications.